Technical Glossary

ADC
Analog to Digital Conversion – The process of transforming analog level signals to digital values.
BIB
Burn-in Board – A fixture to hold the devices for testing, typically socketed or custom fixturing.
Burn-in
A process method exercising components prior to being placed in service, typically at high temperatures.
DAC
Digital to Analog Conversion – The process of transforming digital values to analog levels.
DAQ
Data Acquisition abbreviation
Driver
An external chamber PCB serving as a stimulus and monitoring controller to BIBs within a chamber.
DSP
Digital Signal Processing – A process of performing algorithms on the data digitized from analog signals.
DUT
Device Under Test
HAST
Highly Accelerated Stress Test – A testing method utilizing high temperature, humidity and pressure.
HTOL
High Temperature Operating Life – A testing method at high temperature under operating bias.
IPC
A standards organization in the design, printed circuit board manufacturing and electronics assembly.
ITAR
International Traffic in Arms Regulations - ITAR regulations dictate that information and material pertaining to defense and military related technologies may only be shared with U.S. Persons.
MIL-STD 883
A standard of methods, controls, and procedures for testing microelectronic devices.
TCYC
Temperature Cycling – A process method utilizing hot to cold temperature cycling Reference MIL-883 Method 1010.8.
THB
Temperature Humidity Bias – A process method utilizing high temperatures and humidity.
Temperature Abbreviations
T - Temperature.
Ta - Temperature of ambient (the surrounding area).
Tc - Temperature of case.
Tj - Temperature of Junction.
Tjc - Temperature difference of junction to case.
Tja - Temperature difference of junction to ambient.